| COPPER PHOSPHOROUS ALLOYS |  |
|
| UTP PRODUCT | APPLICATION |
BARE
RODE
|
FLUX
COATED
|
GAS
|
|
35
|
Copper
phosphorous alloys containing 5% Ag. Used for joining copper to copper without a flux Main usage in refrigeration industry Melting temperature 650 - 710°C |
 |
 |
|
|
36
|
Copper
phosphorous alloys containing 2% Ag. Used for joining copper to copper without a flux Melting temperature 645 - 740°C |
|
|
|
|
37
|
Copper
phosphorous alloys containing 0% Ag. Used for joining copper to copper without a flux Working temperature 710°C |
|
|
|
|
LOW
TEMPERATURE SOLDER
|
|
570
|
Tin solder
containing 4% Ag. Low melting temperature 220°C. Good electrical conductivity. Ideal on stainless steel within food industry. Requires 570F flux. |
|
|
|