COPPER PHOSPHOROUS ALLOYS

UTP PRODUCT APPLICATION
BARE RODE
FLUX COATED
GAS
35
Copper phosphorous alloys containing 5% Ag.
Used for joining copper to copper without a flux Main usage in refrigeration industry Melting temperature 650 - 710C
36
Copper phosphorous alloys containing 2% Ag.
Used for joining copper to copper without a flux Melting temperature 645 - 740C
37
Copper phosphorous alloys containing 0% Ag.
Used for joining copper to copper without a flux Working temperature 710C

LOW TEMPERATURE SOLDER
570
Tin solder containing 4% Ag.
Low melting temperature 220C. Good electrical conductivity. Ideal on stainless steel within food industry. Requires 570F flux.